MX6974F5 Qualcomm QCN9074 / 5.8GHz / PCI Express 3.0 / 802.11ax / WIFI6 Module

广寒凝月

MX6974F5 Qualcomm QCN9074 / 5.8GHz / PCI Express 3.0 / 802.11ax / WIFI6 Module

Description
MX6974 F5 802.11ax Embedded Wireless modules that adopts M.2 E-key and supports PCI Express 3.0 protocol. It adopts Qualcomm  802.11ax Wi-Fi technology, supports the 5180-5850GHz frequency band, has AP and STA functions with 4x4 MIMO and 4 spatial streams, suitable for applications of 5GHz IEEE802.11a/n/ac/ax. It is equipped with a dynamic frequency selection (DFS) function which has higher transmission efficiency than the previous generation.
Specifications
Type: Wireless Module
Chip: QCN9074
IEEE Standard: IEEE 802.11ax
Connector: PCI Express 3.0, M.2 E-key
Working voltage: 3.3V/5V
Frequency range: 5G：5.180GHz~5.850GHz
Modulation technology: 802.11n：OFDM（BPSK，QPSK，16-QAM，64-QAM，256-QAM）
802.11ac：OFDM（BPSK，QPSK，16-QAM，64-QAM，256-QAM）
802.11ax：OFDMA （BPSK，QPSK，DBPSK，DQPSK，16-QAM，64-QAM， 256-QAM，1024-QAM，4096-QAM）
Power (per chain): 802.11ax：Max. 21dBm
Power consumption: ≦15W
Receiving Sensitivity:
11ax:HE20 MCS0 <-89dBm / MCS11 <-64dBm；HE40 MCS0 <-89dBm / MCS11 <-60dBm；HE80 MCS0 <-86dBm / MCS11 <-58dBm；
Antenna Connector: 4 x U. FL
Operating Environment: Temperature: -20°C to 70°C/-4 ~ 158℉; Humidity: 95% (non-condensing)
Storage Environment: Temperature: -40°C to 90°C/-40 ~ 194℉; Humidity: 90% (non-condensing)
Certification: RoHS/REACH
Weight: 20g
Dimensions (W*H*D): 60 x 57 x 4.2 mm (±0.1mm)